Manufacture Capability
| Item | Capability | |
|---|---|---|
| Layer Count | MP: 24L / SP: 30L | |
| Thickness | 0.15~6.0mm | |
| Material | FR-4 | FR4 - Mid. Tg~High Tg Halogen free - Mid. Tg~High Tg Std. Loss~Ultra Low Loss |
| Min Core | 2mil | |
| Copper | Internal | ½oz, 1oz~6oz |
| External | ½oz, 1oz~3oz | |
| Max Shipping Size | 19.5”*22.5” | |
| (495 mm x 571 mm) | ||
| Min Trace Width/Space | I/L(½oz) | Limited:1.8/1.8mil Normal:2.0/2.0mil |
| O/L(½oz + plating) | Limited:2.0/2.0mil Normal:2.3/2.3mil | |
| Drilling | Min FHS (D1) | 5mil |
| Min DHS (D2) | 5.9mil | |
| Min Ring (D3) | D2 + 8mil | |
| Min AntiPad (D4) | D2 + 14mil | |
| Max Shipping Size | BDHS (D5) | D2 + 10mil |
| Stub Length (D7) | 8 ± 4mil | |
| Accuracy (D6) | ± 4mil | |
| Back Drill Clearance (D8) | D5 + 12mil | |
 | ||
| PTH Plating Aspect Ratio | Max A/R (Board thickness/ Min finish hole size) | 1:20 |
| Micro Via/Skip Via | 1:1 | |
| Soldermask | Color | Green / Blue |
| Red / Yellow / Black | ||
| Min. Dam | 3mil | |
| Min. Clearance | 2mil | |
| Min. Coverage | 2.5mil | |
| Legend | Color | White / Yellow / Black |
| Min. Width | 4mil | |
| Surface Finish | Trement | OSP / Gold Plating / ENIG / IMAg / HASL / Selective ENIG /IMSn / LF HASL |
| Tolerance | Impedance | ± 8% |
| Dimension | Routing：± 4mil | |
| V-Cut：± 4mil | ||
| Thickness | ± 10% | |
| PTH | ± 3% | |
| NPTH | ± 2% | |
HDI
| Item | Capability | |
|---|---|---|
| HDI | Max stack via | 5+N+5 / Any Layer |
| Max skip via | 2+N+2 | |
| Min laser hole diameter | 4mil | |
| HDI board filling material | Resin filling / Copper Filled Via Plating Expansion | |
| Max aspect ratio | 1 | |
 | ||
Manufacturing Equipment
Inner Layer-DI Exposure
Inner Layer-AOI
Lamination-CCD Auto Alignment Welding
Drilling-Mitsubishi(GTW5) Laser Drilling Machine
Drilling-Laser Via AOI
Outer Layer-Auto Exposure
Plating-Pulse VCP
Plating-Auto VCP
Silk Screen-High-Speed Legend Printer
Routing: CCD Alignment Machine
Testing: ATG Automatic Flying Probe
Testing: EMMA Automatic Flying Probe
FQC-AVI Auto Visual Inspection Machine
FQC- Bow and Twist Inspection Machine
KEYSIGHT ENA Network Analysis
Quality Policy
Circuitech implements and maintains quality policies based on market demand, customer requirements, and internal management needs. Circuitech establishes quality goals and continuously improves the quality management system. Additionally, Circuitech ensures that employees understand and implement the policy through their daily operations.
Quality Policy/Objectives
Quality Policy
- Implement – Commitment, Prevention and Implementation
- Pursue Excellence - Improvement and Prevention
Quality Objectives
At the end of each year, the Quality Assurance Department creates and suggests the goals for each department for the following year, in accordance with the company’s quality policy. Once approved by the general manager, these goals must be incorporated into the business plan and executed.
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- CQC
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- ISO 13485
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- IATF 16949
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- ISO 45001
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- ISO 45001
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- ISO 9001
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- ISO 14001
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- QC 080000
