Exclusively for High-Reliability Electronic Products
IPC / AI Servers

IPC / AI Servers
Layer Count:18L
Type:Multilayer/Gold Finger
Material:TU883(HVLP)
Application:Industrial, Telecom and Cloud Scalable Server

IPC
Layer Count:16L
Type:HDI 2N2 / Back Drill
Material:TU933+(HVLP)
Application:Computer On Modules

IPC / AI Servers
Layer Count:16L
Type: HDI 4N4
Material: TU883C
Application: AI Server,5th/4th Gen Intel® Xeon® Scalable Family

IPC / AI Servers
Layer Count:12L
Type:Multilayer / Back Drill
Material:NPG170D
Application:Network Appliance/Edge Computing Server

IPC
Layer Count:10L
Type:Multilayer/Gold Finger
Material:NP175FM
Application:Gaming Platform Solutions/Graphics Cards and Edge AI Acceleration Modules

IPC
Layer Count:10L
Type:HDI 4N4
Material:NPG170D
Application:RISC Platform
Communication / AIoT

IIoT
Layer Count:12L
Type:Multilayer/Resin Plugging
Material:NP175FM
Application:Audio video switch

AIoT
Layer Count:10L
Type:Multilayer/Gold Finger
Material:TU862HF
Application:BiCS5 FLASH SSD

AIoT
Layer Count:10L
Type: Multilayer / Resin filling
Material: NP155F
Application: Network Appliance

Network Storage
Layer Count:10L
Type: Multilayer/Gold Finger
Material: NPGN150LK
Application: Network Attached Storage

Network Storage
Layer Count:8L
Type:Multilayer
Material:NP175FM,
Application:SOM(NVIDIA Partner Network)

Network Storage
Layer Count:8L
Type:Multilayer
Material:NP155F
Application:AI Edge Computing
Automotive

Automotive
Layer Count:8L
Type:Multilayer
Material:NP155F
Application:Automotive In-Vehicle Display

Automotive
Layer Count:4L
Type:Gold Finger
Material:VT481
Application:Car Audio

Automotive
Layer Count:2L
Type: Thickness 0.16mm
Material:FR408
Application:Automotive In-Vehicle Display