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A world class Automotive Parts customer is developping a new generation Car-audio system and require a ultra thin PCB.
This PCB originally was using the Flex Circuit material to reach the function requirement. Circuitech is able to work with customer and change to FR4 material and achieve mass-production with significant yield rate improvement. |
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Home > Business service > Products > BackPlane / High Layer Count PCB |
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BackPlane / High Layer Count PCB |
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Features |
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| Largest panel format ~ 21” x 22” | | Board thickness up to 0.250” | | High layer count up to 30 layers | | Quick turn, prototype and production volume | | ISO14001, QS9000, ISO9001, IATF16949,QC080000, ISO13485 | | HDI micro via | | Advanced equipment for Backpanel and HLC production | | Advanced technology for Via in Pad (VIPPO)、Back Drill and HLC+HDI | | Lower Df material selection enables better signal transmission performance and meet new Intel Set2dil insertion lost test criteria | | Consulting service to help customer design |
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Applications |
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Telecommunication, high-end computing, industrial equipment, consumer electronics |
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ADD : No. 6, Andong Rd., Zhongli Dist., Taoyuan City 32063, Taiwan (R.O.C.) TEL : 886-3-4624100 FAX : 886-3-4612103 |
ADD2 : No. 900 Hanpu Road, Kunshan City, Jiangsu Province, China TEL: 86-512-57753888 FAX : 86-512-57765887 |
© 2012 CIRCUITECH Co.,Ltd. All rights reserved |
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