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Effective mass-production in handling Halogen free, high
Tg (>180C), very low loss (Df < 0.009) laminate materials.
 
Develop Heavy copper cladding structure PCB with 5oz+
outer layer and 12oz+ inner layers.
 
Develop and obtain in-depth know-how in handling high
speed (10 GHz and above), high layer count (24 layers
and above)server type PCB.
 
Effective mass-production development of high aspect ratio PCB structure to 2013 target 15: 1
 
Develop and meet mass-production goal for HDI (High
Density Interconnection) process of both sequential and
additive lamination construction process for Blind and
Buried vias.
 
 
 
 

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