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HDI PCB 4+N+4
 
  Features
 
Suitable for BGA with lower I/O counts
Fine line, micro via and registration technologies capable of 0.4 mm ball pitch
Qualified material and surface treatment for Lead-free process
Excellent mounting stability and reliability
Epoxy or Copper filled via
   
  Applications
  Cellular phone, Tablet, MP3 Player, PDA, GPS, memory card
 
 
 

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